Inner-Layer Exposure
LDI direct imaging for fine inner-layer lines — micron alignment ensures line/space consistency.
The six technologies work together across the critical digital steps of electronics and advanced manufacturing.
LDI direct imaging for fine inner-layer lines — micron alignment ensures line/space consistency.
Line exposure and auto-alignment before pattern plating — balancing throughput and yield.
CTS direct screen exposure for solder mask — opening accuracy beats manual mask mounting.
High-precision legend screen prep for dense, fine legend graphics.
Screen-free digital solder-mask jetting — on-demand ink, near-zero waste.
Flexible small-batch legend jetting — instant changeover, no screen setup.
Exploring print-based additive circuitry for shaped & specialty substrates.
Integrated digital line combining LDI + CTS + Inkjet.
Yellow-light lithography for 3D/3.5D automotive center-console glass.
Fits 1500×700mm-class curved automotive glass.
Precision platemaking for high-forgery-risk scenarios.
Visual security & brand protection for labels and packaging.
Electrolytic + ultrasonic removal of oil, rust, sulfide and high-temperature carbon.
Near-zero damage cleaning of cores, inserts, pins and sleeves.
10 μm FM dots · zero scrap · 65% developer and 80% waste reduction.
AJL-119 dry-ice cleaning — no secondary pollution, substrate-safe.
Digital inkjet publishing for books, newspapers and commercial print — on-demand, instant changeover, multi-SKU small-batch and personalization.
Smart system combining inkjet printing with RFID label manufacturing — on-demand antenna and graphics jetting with high-frequency changeover.
Industrial wastewater treatment for printing and surface-treatment — focusing on developer and wash-liquor reduction and compliant discharge.
Large-file fast processing for wide-format, high-resolution artwork — second-level rendering and stable output.
Our process engineers can provide equipment selection and sampling validation based on your product and capacity.