LDI Laser Direct-Write Lithography

Laser Direct-Write Lithography · UV laser scan exposure, no traditional mask

How It Works

LDI Laser Direct-Write Lithography

LDI uses a UV laser with a DMD or galvanometer optical system to directly scan-expose circuit patterns onto photosensitive laminates — replacing mask and photoplotting entirely. Patterns are data-driven, so changeovers are instant and accuracy and consistency improve markedly.

Alignment down to ~0.1μm for higher fine-line yield
No mask waste — extremely low cost for small/frequent batches
Covers inner/outer layers, solder mask, legend and more

Key Advantages

Alignment down to ~0.1μm for higher fine-line yield

No mask waste — extremely low cost for small/frequent batches

Covers inner/outer layers, solder mask, legend and more

Specifications

Parameter	Description
Alignment	±1.5 μm
Throughput	≤ 7 s / panel
Max Panel	610 × 711 mm (24″×28″)
Processes	Inner · Outer · Solder mask · Legend
Software	Dedicated DI control software + MES interface
Substrate	Copper-clad laminate · Dry film · Liquid resist

Example values (typical industry reference, not MCLANTIS actual specs — replace before launch)

Applications

LDI

Inner-Layer Exposure

Fine-line, high-alignment circuit imaging.

LDI

Outer-Layer Exposure

Direct imaging & alignment before pattern plating.

ALL

Smart Production Line

Digital line integrating all three techs.

Need a tailored process solution?

Our process engineers can provide equipment selection and sampling validation based on your product and capacity.